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Physics-based electromigration lifetime modeling for low-temperature Sn-Bi-Ag solder interconnects via single-condition calibration and microstructural evolution analysis

Authors: S.B. Wang, J. Ren, M.L. Huang

Publication: Journal of Materials Science & Technology

Published: Mar 1, 2027

Source: Crossref

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Physics-based electromigration lifetime modeling for low-temperature Sn-Bi-Ag solder interconnects via single-condition calibration and microstructural evolution analysis

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